Modeling and thermal analysis of electronic devices on board space vehicles

Аuthors

Khairnasov K. Z.

Moscow Aviation Institute (National Research University), 4, Volokolamskoe shosse, Moscow, А-80, GSP-3, 125993, Russia

e-mail: kamilh@mail.ru

Abstract

Purpose

In this paper, the methodology of thermal calculation of the electronic devices forspacecrafts operating in a vacuum is developed. Thermal analysis of real electronic devices was produced and the effect of the thickness of the intermediate copper layers of multilayer printed circuit boards (ML PCB)was examined for the removal of extra heat from electronic components.

Design/methodology/approach

An electronic device was modeled by means CAD-system CATIA and was solved with finite element method (FEM) and compared with solution obtained via analytical methods.

Findings

The study and mathematical modeling of thermal modes of electronic modules, operating in compartments of the spacecraft, performed by FEM, showed that the addition in the ML PCBextra layers of copper provides required temperatures of the electronic devices. The dependence of electronic devices temperature from the thickness of the intermediate copper layer was determined and the optimum thickness of intermediate layers was received. Reliability of the results obtained in CATIA was repeatedly tested on the test examples. In the present study, the accuracy of the calculations was checked by thickening the finite element mesh.

Practical implications

Mathematical models and the results of modeling of heat transfer processes obtained in this paper can be used as a practical guide for thermal design of new equipment.

Originality/value

Optimal value can be accepted for thickness of the intermediate copper layers of ML PCB.The value of this work lies in the practical application of research results to the design of equipment used in the space

Keywords:

electronic devices, mathematical modeling, thermal mode, finite elements method

References

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2. Lukas Dzh. Teploobmen i teplovoi rezhim kosmicheskikh apparatov (Heat transfer and thermal regime of the spacecraft), Moscow, Mir, 1994, 543 p.
3. Godin E.M., Khairnasov K.Z., Sokolskii M.L. Sistemy avtomatizirovannogo proektirovaniya i osnovy system upravleniya proizvodstvom (Systems of automated design and basics of production management systems: a Tutorial), Moscow, MAI, 2004, 68 p.