Development of automation of technological process of laser controlled thermocracking of semiconductor and dielectric

Аuthors

Tretiyakova O. N.^*, Shevchenko G. Y.^**

Research Institute «Electronic special technological equipment», ESTO, 5-20, pr. 4806, Zelenograd, 124498, Russia

*e-mail: tretiyakova_olga@mail.ru
**e-mail: shev.gleb@gmail.com

Abstract

The choice of technological modes for laser controlled thermocracking is relevant, but at the same time difficult multi-parameter task, which can be solved mainly through experimentation. The complexity of the problem is caused by the need to consider interrelation of parameters for laser radiation, the intensity and mode structure of laser radiation, the velocity of the beam and its shape, the orientation of the beam in space, and physical properties of semiconductor material etc. The developed software designed to manage the cutting of semiconductor and dielectric, using laser controlled thermocracking and automates the choice of modes of cutting laser controlled thermocracking.

Keywords:

laser, software, laser controlled thermocracking, semiconductor, dielectric, programming environment, computer modeling.